Cloud Packaging Equipment will be exhibiting in booth #2855 at PACK EXPO International in Chicago November 2-5. Cloud are pleased to provide you with FREE registration to the show! Be sure to visit them whilst you are there. On hand will be their experts and top executives to answer your questions. 

Cloud Packaging Equipment, an industry leader in building high-speed, high-volume HFFS equipment, understands your exact count requirements, uptime, line demands and desire for higher yields and reliability.

Exhibiting at the show the Hydroforma, the world’s fastest water-soluble pouch packer, running powder applications at up to 2000* pouches per minute and liquid applications at up to 800* pouches per minute (*depending on product). 

Robert's Packaging, which is part of the Cloud Packaging Equipment family, expands the depth of Cloud's equipment line will join them on the stand with the IMP 1500 from the IMP series of fill - seal machinery.  With traveling funnels, the Robert machine is able to maintain speed on hard to fill products.